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Home > Call for Papers
Topic
Metallurgy, Weldability & Corrosion
Residual Stress/Distortion/Modeling
Welding Strength/Integrity
Arc Physics/Visual/ Simulation
Sensing and Monitoring/Welding Processes/Welding automation
Laser / Electron Beam Welding & Processing
Friction Stir Welding/Process
Electrical Resistance Welding
Electronic Packaging Reliability
Electronic Packaging Materials
Nano/Microjoining Process
Diffusion Bonding, Brazing, TLP Bonding, Soldering
Surface Modification
Inspection / Evaluation / Education & Qualification